Transcend MSA470P mSATA SSDs

Transcend's SATA III 6Gb/s mSATA SSD MSA470P is a Power Loss Protection (PLP) SSD. During unexpected power outages, the built-in tantalum capacitor provides power to the controller and DRAM cache, ensuring data integrity and storage reliability.

Featuring the Serial ATA interface and a powerful controller, Transcend's SATA III 6Gb/s MSA470P mSATA SSD delivers reliable performance. The MSA470P features the new 112-layer 3D NAND technology for high storage efficiency and a built-in DRAM cache for fast access. The 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistor guarantee its reliability in harsh conditions. Transcend's MSA470P is fully tested in-house, operating stably in a wide temperature range (-40℃~85℃). The compact mSATA form factor is just one-eighth the size of a standard 2.5" SSD, making it perfect for use in space-constricted portable devices such as Ultrabooks, tablet PCs, and slim servers.

mSATA SSDs

MSA470P

Transcend’s SATA III 6Gb/s mSATA SSD MSA470P is a Power Loss Protection (PLP) SSD. During unexpected power outages, the built-in tantalum capacitor provides power to the controller and DRAM cache, ensuring data integrity and storage reliability.

Featuring the Serial ATA interface and a powerful controller, Transcend’s SATA III 6Gb/s MSA470P mSATA SSD delivers reliable performance. The MSA470P features the new 112-layer 3D NAND technology for high storage efficiency and a built-in DRAM cache for fast access. The 30µ” gold finger PCB, Corner Bond technology, and anti-sulfur resistor guarantee its reliability in harsh conditions. Transcend’s MSA470P is fully tested in-house, operating stably in a wide temperature range (-40℃~85℃). The compact mSATA form factor is just one-eighth the size of a standard 2.5″ SSD, making it perfect for use in space-constricted portable devices such as Ultrabooks, tablet PCs, and slim servers.

Technologies

112-Layer 3D NAND Flash

30µ” PCB Gold Finger

Corner Bond

Wide Temperature

Dynamic Thermal Throttling

Thermal Sensor

Read Disturbance

Anti-Sulfur Technology

Garbage Collection

Wear Leveling

TRIM

Bad Block Management

Power Loss Protection (PLP)

Early Move

Firmware Features
Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Advanced Garbage Collection
Static Data Refresh
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
TRIM command for better performance
NCQ command for better performance
Power-saving DevSleep (Device Sleep) mode (optional)
Hardware Features
Compliant with RoHS 2.0 standards
Compliant with JEDEC MO-300A
Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
Key components fortified by default with Corner Bond technology
30µ” PCB gold finger
Anti-sulfur technology implemented to prevent sulfurization in the environment
Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
Promised operational reliability in a wide temperature range (from -40°C to 85°C)