Transcend MTE560P PCIe M.2 SSDs
Transcend’s M.2 SSD MTE560P is a Power Loss Protection (PLP) SSD. During unexpected power outages, the built-in tantalum capacitor provides power to the controller and DRAM cache, ensuring data integrity and storage reliability. The MTE560P also complies with the TCG (Trusted Computing Group) Opal 2.0 standards. Data is protected using the hardware-based AES 256-bit encryption and LBA (Logical Block Address) sector-specific permissions.
Transcend’s M.2 SSD MTE560P features a PCI Express (PCIe) Gen4 x4 interface, 112 layers of 3D NAND flash, and SLC Mode technology, delivering high sustained speeds and SLC-grade durability. In addition, the 30µ” gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend’s MTE560P is also 100% chamber tested in-house for wide operating temperatures of -40℃~85℃.
Transcend's M.2 SSD MTE560P is a Power Loss Protection (PLP) SSD. During unexpected power outages, the built-in tantalum capacitor provides power to the controller and DRAM cache, ensuring data integrity and storage reliability. The MTE560P also complies with the TCG (Trusted Computing Group) Opal 2.0 standards. Data is protected using the hardware-based AES 256-bit encryption and LBA (Logical Block Address) sector-specific permissions.
Transcend's M.2 SSD MTE560P features a PCI Express (PCIe) Gen4 x4 interface, 112 layers of 3D NAND flash, and SLC Mode technology, delivering high sustained speeds and SLC-grade durability. In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE560P is also 100% chamber tested in-house for wide operating temperatures of -40℃~85℃.
Firmware Features
Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Advanced Garbage Collection
Early Move
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
TRIM command for better performance
NCQ command for better performance
Wear-Leveling
Full drive encryption with Advanced Encryption Standard (AES)
Compliant with TCG Opal specifications and IEEE 1667 standards
Power-saving DevSleep (Device Sleep) mode (optional)
Hardware Features
Compliant with RoHS 2.0 standards
Compliant with PCI Express specification 4.0
Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
PCIe Gen 4 x4 interface
DDR4 DRAM Cache embedded
Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
Key components fortified by default with Corner Bond technology
30µ” PCB gold finger
Anti-sulfur technology implemented to prevent sulfurization in the environment
Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
Promised operational reliability in a wide temperature range (from -40°C to 85°C)
*Supports Microsoft® eDrive standard
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